Welcome to the latest instalment of T-Global's Newsletter, this issue we'll be sharing with you details of our new, best in class conductivity thermal tape, a detailed article to help you understand the ASTM E595 test method for low outgassing in high vacuum requirements, industry applications for datacentres and a quick guide to our thickness and dimensional tolerances...
We’re pleased to announce the launch of our highest thermally conductive adhesive tape to date, introducing T1002 Thermal Tape. This versatile tape offers our best in class thermal conductivity of 2.1 W/mK alongside a low thermal impedance of 0.84 °C·in²/W at 30 psi and provides long-term, reliable performance to efficiently transfer heat from heat sources to heatsinks.
Typical applications will include LED modules, display panels, power supplies, IC chips, MOSFETs, routers, network equipment and heat sink assemblies across consumer and industrial electronics, power electronics and lighting equipment.
TG-T1002 Thermal Tape Product Overview:
2.1 W/mK thermal conductivity for efficient heat transfer
Low thermal Impedance for improved cooling performance
Strong adhesion for secure component attachment
Custom die-cut shapes available for application-specific designs
With the continued growth of technologies including 5G, IoT, AI and cloud computing the supply chain demand for the server industry is experiencing exponential growth. Servers are the backbone of all digital communications with an ‘always on’ set up to enable data flow with requests and responses to clients.
The approaches to thermal management can vary depending on the type of server and the specific requirements of the data centre or server room, with a key focus being placed on energy efficiency. In addition to the use of Thermal Interface Materials and products such as Heat Sinks, Vapor Chambers and Phase Change Materials for dissipating heat away from the heat source of device and it’s components, other techniques such as liquid and air cooling are also used. This approach ensures the risks of downtime and reduced life span caused from overheating are minimal.
ASTM E595 is the internationally recognised test method used to determine the outgassing characteristics of materials exposed to high vacuum environments.
ASTM E595 was developed in response to the need to control molecular contamination on spacecraft. During the 1970s, NASA increasingly recognised that spacecraft and satellites had to be designed with outgassing risks in mind, particularly for materials used in high-vacuum environments where even trace contamination could compromise performance.
The E595 standard established a consistent method for evaluating the outgassing characteristics of materials, helping determine whether they were suitable for use in contamination-sensitive applications.
Our Low Outgassing Thermal pads are engineered for applications where thermal performance must be combined with exceptional material cleanliness and long-term reliability. Manufactured to meet the stringent NASA and ESA requirements for low outgassing, these advanced thermal interface materials these advanced thermal interface materials (TIMs) minimise the release of volatile compounds in enclosed, vacuum, and contamination-sensitive environments while delivering efficient heat transfer between components and heat sinks. Find out more about the standard and our new range of pads here.
T-Global Technology's portfolio of Thermal Interface Materials offers hundreds of parts in a range of different thicknesses and sizes. This handy thickness and dimensional tolerance guide covers Thermal Pads, Graphite / Graphene Sheets, Heat Sinks and Heat Spreaders.
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