Welcome to the latest instalment of T-Global's Newsletter, this issue we'll be sharing with you details of the latest addition to our reinforced thermal pads line, how to access our thermal simulation service, industry applications for medical devices, a showreel for our hybrid thermal pads and the last chance to secure free tickets to Hardware Pioneers Max courtesy of T-Global.
We’re pleased to announce the launch of TG-A9000F Reinforced Thermal Pad, our best in class reinforced thermal pad designed for demanding, high-power applications. With 7.0 W/mK thermal conductivity, a single-sided fibreglass reinforced design, low thermal impedance and strong tear resistance, TG-A9000F Reinforced Thermal Pad offers a reliable option for applications such as EVs, servers, data centres, and PSUs. Its combination of compressibility, electrical isolation, and dimensional stability helps support easier processing and dependable long-term thermal performance in challenging environments.
Thermal management requirements in medical devices are increasingly aligned with those in other advanced electronics sectors, where compact form factors, higher processing speeds and continuous operation create greater heat loads. Medical devices must always remain within safe operating temperature ranges, as overheating can lead to inaccurate data, reduced performance, shorter service life and, most importantly, potential risks to patient safety. Effective thermal management removes excess heat from sensitive components, helping to maintain reliable operation, improve long-term stability and extend device lifespan.
In medical optronics and other precision electronic systems, thermal interface material selection is especially important. Devices that incorporate imaging modules, sensors, camera-based diagnostics, optical instruments and monitoring systems can be highly sensitive to contamination, so silicone-free formulas are often preferred where silicone oil bleed or siloxane volatilisation could affect optical clarity, sensor accuracy or electronic reliability. T-Global offers both silicone and non-silicone thermal solutions developed for silicone-sensitive applications including medical electronics and optical precision equipment. These materials provide efficient heat transfer, electrical insulation and low thermal impedance while reducing the risk of residue, outgassing or migration onto critical surfaces. Find out more about our products and their associated medical device applications here.
With accelerated product development cycles and the growing complexity of high-density electronics, T-Global not only provides thermal interface materials but also thermal engineering and consulting services. Backed by advanced thermal simulation software (Flotherm XT) and a team of experienced thermal engineers, we offer preliminary simulation planning and expert thermal design guidance.
Our thermal simulation consulting services are suitable for virtually any electronic product. Simply provide your CAD files and our specialist team will carry out a detailed thermal simulation analysis on your behalf, saving you time and money on R&D.
T-Global Technology will be exhibiting at Hardware Pioneers Max 2026, the UK’s largest exhibition and conference for cutting-edge electronics, engineering innovation, and hardware development. The event, held on 10-11 June at ExCeL London, attracts thousands of engineers, product designers, and technology leaders. T-Global Technology will be located at Stand C10 in the North Halls (N1–N4), where visitors can speak directly with our thermal management experts about their heat dissipation challenges, product design requirements, and performance optimisation needs. We have a limited number of free passes for core tickets available for our customer base, if you’d like to attend the show courtesy of T-Global simply click hereand we’ll take care of the rest.
Click the thumbnail below to view the showreel for our TG-AD Series hybrid thermal pads that perform like a putty. This short video provides a comprehensive product overview, highlighting the series’ key characteristics alongside side-by-side comparison tables for thermal impedance and deflection rates for contact pressures of 10, 30 and 50 PSI.
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